P459 – 2″ UHV sputter deposition system LMU
Application
UHV sputter deposition cluster tool for thin film and multilayer deposition at 2″ substrates
Year of delivery
2017
Installation site
LMU, Munich, Germany
Design Features
- UHV multichamber magnetron sputter deposition system with combination of confocal and face to face sputtering.
- In two sputter chambers up to eleven magnetrons can be installed.
- Deposition uniformity better than 5% in both chambers.
- One 2″ magnetron and two 3″ magnetrons can be used in face to face as well as confocal configuration in one chamber (called SP2).
- Eight 2″ magnetrons can be used in confocal configuration in the second sputter chamber (called SP4).
- All 2″ magnetrons and one 3″ with pneumatic in situ tilting.
- One 3″ magnetron with pneumatic linear translation.
- Fully motorized 3 axes sample manipulator with integrated motorized wedge shutter and maximal sample temperature well above 800°C.
- Ion source for sample precleaning, mild etching, plasma treatment and oxidation in SP2 chamber.
- Load lock chamber with storage and lamp heating.
- Integrated bake out system.
Special Features
- Four 2″ magnetrons in SP4 can be used in face to face configuration too.
- All magnetrons (2″ as well as 3″) in SP4 can be used in face to face configuration too.
- Load lock chamber is prepared for adding a third deposition chamber.
- Handling incl. in situ exchange of sample masks in both sputter chambers.
- Different sample sizes from 4″ wafer down to 10mm x 10mm samples can be handled (using different kind of sample adapters).
Outer Dimensions
Technical specifications and performance values
General
Sputtering chamber SP2
Size
About 800 mm diameter, about 700 mm height
Material
stainless steel
Sputtering chamber SP4
Size
About 800 mm diameter, about 700 mm height
Material
stainless steel
Load lock chamber
Size
About 200 mm diameter, about 400 mm height
Material
stainless steel
Vacuum
Sputtering chamber SP2
Base pressure
< 2 * 10-9 mbar
Pump down time
1.5 hours to < 10-7 mbar
Chamber pumping
Turbo pumping stage, chamber lid differentially pumped by dry foreline pump
Bake out
< 150°C
Sputtering chamber SP4
Base pressure
< 2 * 10-9 mbar
Pump down time
1.5 hours to < 10-7 mbar
Chamber pumping
Turbo pumping stage, chamber lid differentially pumped by dry foreline pump
Bake out
< 150°C
Load lock chamber
Base pressure
< 5 * 10-8 mbar
Pump down time
3.5 hours to < 10-7 mbar
Chamber pumping
Turbo pumping stage with dry foreline pump
Manipulator features
Sputtering chamber SP2
Sample size
diameter max. 2″ substrate
Motion axes
3 motorized axes (manipulator arm rotation, z tranlsation and (continous) sample stage rotation)
Motorized wedge shutter (part of the manipulator head) with a motion speed of min. about 0.4µm/s and max. about 5mm/s, incl. speed profile feature
Temperatures
Room temperature (not stabilized) up to 650°C at sample
Special features
Handling of sample masks
UHV thickness sensor head incl. shutter integrated
Sputtering chamber SP4
Sample size
diameter max. 2″ substrate
Motion axes
3 motorized axes (manipulator arm rotation, z tranlsation and (continous) sample stage rotation)
Motorized wedge shutter (part of the manipulator head) with a motion speed of min. about 0.4µm/s and max. about 5mm/s, incl. speed profile feature
Temperatures
Room temperature (not stabilized) up to 650°C at sample
Special features
Handling of sample masks
UHV thickness sensor head incl. shutter integrated
Load lock chamber
(Sample storage)
Storage size
6 sample holders
Sample size
diameter max. 2″ substrate
Motion axes
2 manual axes (rotation, z translation)
Rotation axis equipped with an air side indexer plate for easy and fast sample loading via access door or transfer rod
Sample preparation features
Sputtering chamber SP2
Oxydation /
Plasma treatment
max. 10-3 mbar partly ionised gas mixture (using a griddless ion gun)
Gas mixture variable from pure argon up to almost pure oxygen
Ion beam etching /
sample precleaning
Variable ion source to sample distance
Wide range variable ion energy and ion beam current
Load lock chamber
Thermal treatment
max. 300°C at sample (no temperature regulation)
Performance test results
Chamber pump down (Load lock + SP2)
Long time sample heating (SP2)
Chamber pump down (SP4)
Long time sample heating (SP4)
